Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
At a glance
- Source
- NVD
- EPSS
- EPSS 1.24 % · percentile 69 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 617, SD 800, SD 808, and SD 810, in HHO scenarios, during the ACQ procedure, there are possible instances where the search database is incorrectly updated resulting in memory corruption due to buffer overflow.
Weaknesses (CWE)
- CWE-119 — Improper Restriction of Operations within the Bounds of a Memory Buffer
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | CRITICAL 9.8 | CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2015-8994
- GCVE · GCVE-0-2015-9141
CERT-FR advisories
- CERTFR-2018-AVI-164 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 617, SD 800, SD 808, SD 810 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |