Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
En bref
- Source
- NVD
- EPSS
- EPSS 1.19 % · centile 68 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9650, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, and SD 850, the response pointer passed from user space to SDMX_process is not checked before it is used. If the given response buffer length is smaller than 16 bytes, the response values will be written to a memory outside the buffer, possibly in the secure memory area.
Faiblesses (CWE)
- CWE-119 — Opération hors des limites d'un tampon mémoire
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.0 | CRITICAL 9.8 | CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2015-9033
- GCVE · GCVE-0-2015-9180
Avis du CERT-FR
- CERTFR-2018-AVI-164 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_600_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9650, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |