Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
At a glance
- Source
- NVD
- EPSS
- EPSS 1.19 % · percentile 68 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 615/16/SD 415, SD 617, SD 650/52, SD 808, and SD 810, when enabling XPUs for SMEM partitions, if configuration values are out of range, memory access outside the SMEM may occur and set incorrect XPU configurations.
Weaknesses (CWE)
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.0 | CRITICAL 9.8 | CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 10.0 | AV:N/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2015-9050
- GCVE · GCVE-0-2015-9197
CERT-FR advisories
- CERTFR-2018-AVI-164 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 615/16/SD 415, SD 617, SD 650/52, SD 808, SD 810 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |