CVE-2017-18124
En bref
- Sévérité
- Non disponible
- EPSS
- EPSS 0.22 % · centile 12 (2026-10-27)
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20
Scores
| Version | Score | Vecteur | Évalué par |
|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Faiblesses (CWE)
Références européennes
Avis du CERT-FR
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:fsm9055_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|
| Qualcomm, Inc. · Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 |
Références
Sources
