CVE-2018-11292
At a glance
- Severity
- Not available
- EPSS
- EPSS 0.30 % · percentile 23 (2026-10-27)
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
Scores
| Version | Score | Vector | Scored by |
|---|
| CVSS 3.0 | HIGH 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Weaknesses (CWE)
European references
CERT-FR advisories
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6584_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd412_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 |
References
Sources
