CVE-2018-5871
En bref
- Sévérité
- Non disponible
- EPSS
- EPSS 0.28 % · centile 20 (2026-10-28)
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected.
Scores
| Version | Score | Vecteur | Évalué par |
|---|
| CVSS 3.0 | MEDIUM 6.5 | CVSS:3.0/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:H/A:N | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | LOW 3.3 | AV:A/AC:L/Au:N/C:N/I:P/A:N | NVD · nvd@nist.gov (Primary) |
Faiblesses (CWE)
Références européennes
Avis du CERT-FR
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|
| Qualcomm, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | affected MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 |
Références
Sources
