Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
En bref
- Source
- NVD
- EPSS
- EPSS 0.51 % · centile 43 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Description
Out of bound memory access can happen while parsing ADSP message due to lack of check of size of payload received from userspace in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130
Faiblesses (CWE)
- CWE-125 — Lecture hors limites
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | CRITICAL 9.1 | CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | LOW 3.6 | AV:L/AC:L/Au:N/C:P/I:N/A:P | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2019-2426
- GCVE · GCVE-0-2019-10622
Avis du CERT-FR
- CERTFR-2020-AVI-190 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | affected APQ8009, APQ8096AU, IPQ4019, IPQ6018, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCN7605, QCS605, SC8180X, SDM710, SDX24, SDX55, SM8150, SM8250, SXR2130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |