Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
En bref
- Source
- NVD
- EPSS
- EPSS 0.20 % · centile 10 ()
- État
- PUBLISHED
- Publiée
- Mise à jour
- Attribuée par
- qualcomm
- Statut NVD
- Modified
Rechercher sur…
Description
Out-of-bound writes occurs due to lack of check of buffer size will cause buffer overflow only in 32bit architecture. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, MDM9150, MDM9205, MDM9607, MDM9650, MSM8905, Nicobar, QCS405, QCS605, Rennell, SA6155P, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SM6150, SM7150, SM8150, SXR1130
Faiblesses (CWE)
- CWE-787 — Écriture hors limites
Références
Scores
| Version | Score | Vecteur | Évalué par |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
Références européennes
- ENISA EUVD · EUVD-2019-5307
- GCVE · GCVE-0-2019-14050
Avis du CERT-FR
- CERTFR-2020-AVI-121 — Multiples vulnérabilités dans Google Android · cert.ssi.gouv.fr
Configurations affectées (CPE NVD)
cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
Produits affectés
| Produit | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | affected APQ8009, MDM9150, MDM9205, MDM9607, MDM9650, MSM8905, Nicobar, QCS405, QCS605, Rennell, SA6155P, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SM6150, SM7150, SM8150, SXR1130 |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| CERT-FR (ANSSI) | Licence Ouverte / Etalab 2.0 |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |