Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
At a glance
- Source
- NVD
- EPSS
- EPSS 1.54 % · percentile 75 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Modified
Description
Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P
Weaknesses (CWE)
- CWE-787 — Out-of-bounds Write
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
| CVSS 2.0 | HIGH 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2020-3556
- GCVE · GCVE-0-2020-11202
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7125_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm7150p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sm8150p_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | affected QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |