Time-of-check Time-of-use (TOCTOU) Race Condition in Automotive Software platform based on QNX (Qualcomm, Inc. Snapdragon)
At a glance
- Source
- NVD
- EPSS
- EPSS 0.07 % · percentile 0 ()
- State
- PUBLISHED
- Published
- Updated
- Assigner
- qualcomm
- NVD status
- Analyzed
Description
Memory Corruption when processing I2C transfer requests due to a race condition between memory allocation and data copying.
Weaknesses (CWE)
- CWE-367 — Time-of-check Time-of-use (TOCTOU) Race Condition
References
Scores
| Version | Score | Vector | Scored by |
|---|---|---|---|
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | qualcomm |
| CVSS 3.1 | HIGH 7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · product-security@qualcomm.com (Secondary) |
| CVSS 3.1 | HIGH 7.0 | CVSS:3.1/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H | NVD · nvd@nist.gov (Primary) |
European references
- ENISA EUVD · EUVD-2026-81326
- GCVE · GCVE-0-2026-25278
Affected configurations (NVD CPE)
cpe:2.3:o:qualcomm:lemans_au_lgit_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:lemansau_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qam8620p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qamsrv1h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qamsrv1m_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6688aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6698aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca6797aq_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:qca8695au_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa7255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa7775p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8195p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8255p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8295p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8540p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8620p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa8770p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:sa9000p_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1h_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1l_firmware:-:*:*:*:*:*:*:*cpe:2.3:o:qualcomm:srv1m_firmware:-:*:*:*:*:*:*:*
Affected products
| Product | Versions |
|---|---|
| Qualcomm, Inc. · Snapdragon | affected LeMans_AU_LGIT ; affected LeMansAU ; affected QAM8255P ; affected QAM8295P ; affected QAM8620P ; affected QAMSRV1H |
Sources
| Source | Licence |
|---|---|
| CVE List (CVEProject cvelistV5) | CVE Program Terms of Use |
| EPSS (FIRST.org) | FIRST — attribution requested |
| ENISA EUVD | ENISA — reproduction authorised, source acknowledged |
| NVD (NIST) via fkie-cad/nvd-json-data-feeds | Public domain — this product uses data from the NVD API but is not endorsed or certified by the NVD |